Features:

• Economical Clamshell Design
• Customized Nest
• Package Dimensions to 25.4 mm
• Pitch Spacing from 0.35 mm
• Surface Mount Spring Probe Contacts

Options:

• Multi DUT Sites, depending upon package size
• Through-Hole Mount Header
• Adaptable to DIP or Grid Array

Package Types:

• QFN, MLF
• BGA, micro BGA
• SOIC, SOT
• PLCC, LCC
• Small QFP & FP (Trimmed and Formed)
• Diodes
• Chip Scale Packages
• Passive Components
• Leaded or Suface Mount Packages