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Flex BI-5 Series Sockets

Features:

  • Economical Clamshell Design
  • Customized Nest
  • Package Dimensions to 12.7mm
  • Pitch Spacing from 0.35mm
  • Surface Mount Spring Probe Contacts

Options:

  • Through-Hole Mount
  • Adaptable to DIP or Grid Array

Package Types:

  • QFN, MLF
  • BGA, micro BGA
  • SOIC, SOT
  • PLCC, LCC
  • Diodes
  • Chip Scale Packages
  • Passive Components
  • Leaded or Suface Mount Packages

 

   
  Flex BI Series:
  Overview
  Flex BI-5
  Flex BI-10