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Flex 10 Socket

Features:

  • Clamshell Design
  • Articulated Tilt Pad for Even Pressure
  • Customized Nest
  • Pitch Spacing from 0.35mm
  • Compression Surface Mount
  • Spring Probe Contacts
  • Maximum Overall Package Dimensions is 1.00" (25.4mm) sq

Options:

  • Ground Contact
  • Floating Plate for BGA Devices
  • Heat Sink in Lid
  • Windows or Porting in Lid
  • Through-Hole Mount
  • Adapt to DIP or Grid Array
  • Adjustable Pressure Lid

Package Types:

  • Leaded and S/M Packages
  • BGA
  • QFP
  • FlatPack
  • SOIC
  • PLCC, LCC
  • MOSFET
  • Custom Package Configurations

 

   
  Flex Series:
  Overview
  Flex 5
* 0.50" (12.7mm) sq
  Flex 7
* 0.75" (19.0mm) sq
  Flex 10
* 1.00" (25.4mm) sq
  Flex 12
* 1.25" (31.8mm) sq
  Flex 15
* 1.50" (38.0mm) sq
  Flex 20
* 2.00" (51.0mm) sq