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Flex 5 Socket

Features:

  • Clamshell Design
  • 3 Axes Tilt Pad for Even Pressure
  • Customized Nest
  • Pitch Spacing from 0.35mm
  • Compression Surface Mount
  • Spring Probe Contacts
  • Maximum Overall Package Dimensions is 0.50" (12.7mm) sq

Options:

  • Ground Contact for Die Ground Paddles
  • Floating Plate for BGA Devices
  • Heat Sink in Lid
  • Windows or Porting in Lid
  • Through-Hole Mount
  • Adapt to DIP or Grid Array

Package Types:

  • QFN, MLF
  • BGA, micro BGA
  • SOIC, SOT
  • PLCC, LCC
  • Diodes
  • Capacitors
  • Inductors
  • ChipScale Packages
  • Leaded or Surface Mount Packages

 

 

   
  Flex Series:
  Overview
  Flex 5
* 0.50" (12.7mm) sq
  Flex 7
* 0.75" (19.0mm) sq
  Flex 10
* 1.00" (25.4mm) sq
  Flex 12
* 1.25" (31.8mm) sq
  Flex 15
* 1.50" (38.0mm) sq
  Flex 20
* 2.00" (51.0mm) sq